Heterogeneous System-in-Package (SiP)
异构系统级封装（SiP）
Connectivity Tiles enable flexibility, scalability and fast time-to-market 连通性瓦片实现了灵活性、可扩展性和快速上市
Embedded Multi-die Interconnect Bridge (EMIB) packaging innovations 嵌入式多芯片互连桥（EMIB）封装创新
Future Tile Variant Examples 未来瓦片变体的例子
Initial tile variant 最初的瓦片变体
96 transceiver operating at up to 28.3 Gbps 96个收发器，运行速度高达28.3 Gbps
Intel® Stratix® 10 DRAM SIP
英特尔®Stratix®10 DRAM SIP
Need for Memory Bandwidth Is Critical
内存带宽的需求至关重要
HPC 高性能计算
8K Video 8K视频
Networking 联网
RADAR 雷达
Financial 金融
Memory Bandwidth 内存带宽
Evolution of Applications Over Time 应用随着时间的演变
Intel® Stratix® 10 DRAM SiP
英特尔®Stratix®10 DRAM SiP
Integrates DRAM with Intel® Stratix® 10 FPGA 整合DRAM与Intel®Stratix®10 FPGA
Unified Quartus and OpenCL design environment 统一的Quartus和OpenCL设计环境
10x more bandwidth versus current discrete solutions 比目前的分立解决方案多10倍的带宽
Up to 512 GB/s of peak memory bandwidth 高达512 GB / s的峰值内存带宽
Widely applicable in HPC, military, broadcast, and communications applications 广泛应用于高性能计算、军事、广播和通信等应用
First Intel® FPGA SiP products all enabled by EMIB technology 第一款全部采用EMIB技术的英特尔®FPGA SiP产品
Intel® Stratix® 10 DRAM SiP-Example Applications
英特尔®Stratix®10 DRAM SiP示例应用程序
DRAM SiP Solves Memory Bandwidth Challenge in Many Applications DRAM SiP解决了许多应用中的内存带宽挑战
Heterogeneous System-in-Package (SiP) Integration
异构系统级封装（SiP）集成
Embedded Multi-die Interconnect Bridge (EMIB) packaging innovations 嵌入式多芯片互连桥（EMIB）封装创新
Intel® Stratix® 10 SiPdevices integrate multiple technologies with FPGAs 英特尔®Stratix®10 SiP器件将多种技术与FPGA集成在一起
Enables flexibility, scalability, and fast time-to-market for new technologies 实现新技术的灵活性、可扩展性和快速上市
SECURE DEVICE MANAGER (SDM)
安全设备管理器（SDM）
Intel® Stratix® 10 FPGA and SoC Security Features
英特尔®Stratix®10 FPGA和SoC安全特性
Secure Device Manager (SDM) 安全设备管理器（SDM）
Sector-based authentication and encryption 基于扇区的认证和加密
Multi-Factor authentication 多因素认证
Physically Unclonable Function (PUF) technology 物理不可克隆功能（PUF）技术
Allows users to build customizable multi-layered security solutions 允许用户构建可定制的多层安全解决方案
The Need for Security Has Never Been Greater
对于安全性的需求空前高涨
Cloud Provider 云提供商
“Rents” accelerator space (A, B, C) to three different companies “租用”加速器空间（A，B，C）到三个不同的公司
-Sector-based security is critical between A, B, C - 在A、B、C之间，实现基于扇区的安全性最为关键
Military Contractor 军事承包商
Develops “secure” algorithms (Sector A); 开发“安全”算法（A扇区）;
Needs to keep separate from non-secure Sector B and C 需要与非安全扇区B和C保持分离
Wireline OEM 有线OEM
Sells software upgrade(40G→100G) using the same hardware. 使用相同的硬件销售软件升级（40G→100G）。
Need to upgrade Sector A securely while Sector B continues running 需要安全地升级扇区A，而扇区B继续运行
Intel® Stratix® 10 Security Advantages
英特尔®Stratix®10安全优势
Sector-based authentication and encryption 基于扇区的认证和加密
Each Sector (A,B,C) can be configured and authenticated separately during configuration and partial reconfiguration. 每个扇区（A、B、C）可以在配置和部分重新配置期间单独进行配置和认证。
Provides robust security between the sectors. 提供部门之间强大的安全性。
Multi-factor authentication 多因素认证
Allows multiple authentication “keys” to be created by separate entities. 允许多个身份验证“密钥”由独立的实体创建。
For example, Sector A needs authentication from two different sources. 例如，A扇区需要来自两个不同来源的认证。
PUF (Physically Unclonable Function) PUF（物理不可克隆功能）
Each FPGA device has a unique SRAM-based PUF (random number generated from the process technology variation) that can be used to encrypt the “root” key in the FPGA; 每个FPGA器件都有一个独特的基于SRAM的PUF（随处理数据生成的工艺技术变化），可用于加密FPGA中的“根”密钥;
prevents “offline” attacks from determining the “root” key. 防止“脱机”攻击确定“根”键。
